What is Through Hole Technology?
Through Hole technology is a technique for building electronic circuits within which the pin-through-hole (PTH) components are embedded through gaps penetrated into printed circuit boards (PCBs). The closures, or leads, are then appended to pads on the other side with molten metal solder using wave soldering or reflow soldering equipment. This process is additionally called through-hole assembly.
Through Hole technology replaced all of the early electronics assembly techniques, for example, point-to-point development technology. From the second era of PCs within the 1950s until the purpose when the surface-mount technology ended up prevalent in the late 1980s, each part on a typical PCB was a through-hole component.
While through-hole mounting gives more grounded mechanical bonds than surface-mount technology procedures, the additional drilling required makes the boards more costly to make. It also limits the available routing area for signal traces on multilayer boards since the holes must suffer all layers to the alternative side. Hence, through-hole mounting is often held for bulkier parts, for instance, electrolytic capacitors or semiconductors in substantial bundles that need extra mounting quality up-to-date physical pressure.
Pros of Through Hole Technology Assembly
- They are accustomed restrict the given routing area used for traces over the layers instantly existing below the upper layers of the multilayer board.
- Through-hole techniques are employed for big size components like semiconductors devices, capacitors, etc.
- For larger size packaging like TO0-220 which needed extra mounting strength and elements like plug connectors used this system.
- For the look of prototyping, there’s the use of through-hole since are often used for breadboard sockets.
- Through-hole elements are best for prototyping circuits having breadboard with the employment of microprocessors like Arduino
- As compared to the SMT the connection configuration among the board and through-hole component are incredibly stronger.
- It is utilized in the development of various varieties of transformers and connectors.
- Due to stronger connection and grip, it Prefers for such environments where high mechanical strength is required.
- It is utilized in an environment large temperature exists.
- Its testing process is simple than other techniques.
- The bonds created between Through hole technology components and also the board are far stronger than surface mount technology bonds, making Through hole technology the perfect choice for components that will undergo mechanical and environmental stress or high heat, like connectors and transformers.
- Through hole technology components also are easy to swap out, making them perfect for prototypes and testing.
Cons of Through Hole Technology Assembly
- As the elements during this technique are passed within the board for these holes are created on the board that’s a costly process.
- Its solder points show less reliability than the opposite techniques
- Its other disadvantage is that offered a limited area for elements on one side of the board and reduces the place for the creation of multiple layers.
- Through hole technology’s soldering process often makes the resulting solder points less reliable than SMT solder.
- The through hole technology assembly process is more involved and thus dearer than SMT.
